Laser-induced Delamination of Thin Films

 

project title: experimental and numerical analysis of a novel laser-induced delamination test for thin films

participants: Amnaya Awasthi, Isaiah kim (PhD) Phuong Tran (PhD), Premasainath selvarasu (MS), soma kandula (phd - now at intel), prof. Nancy Sottos (u. Illinois) and Prof. Philippe Geubelle

Support: NSF GOALI and SRC

Project description: In this combined experimental and numerical research project, we develop a novel non-contact testing procedure to extract the fracture toughness (i.e., energy of delamination) of film/substrate interfaces found in microelectronics applications.



Figure shows the atomistic model assembly of self assembled monolayer sandwiched between a thin film of gold (top) and substrate of silica (bottom)


Related publications:

  1. • Tran, P., Kandula, S., Geubelle, P. H. and Sottos, N. R. (2008) “Hybrid spectral/finite element analysis of dynamic delamination of patterned thin films.” Eng. Fracture Mech., 75:14, 4217-4233. DOI: 10.1016/j.engfracmech.2008.03.006.

  2. • Kandula, S. S. V., Hartfield, C. D., Geubelle, P. H. and Sottos, N. R. (2008) “Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique.” Thin Solid Films, 516:21, 7627-7635. DOI: 10.1016/j.tsf.2008.05.033.

  3. • Kandula, S. S. V., Tran, P., Geubelle, P. H. and Sottos, N. R. (2008) “Dynamic delamination of patterned thin films”. Appl. Physics Letters, 93, 261902-1-3. DOI: 10.1063/1.3056639.

  4. • Kitey, R., Geubelle, P. H. and Sottos, N. R. (2009) “Mixed-mode interfacial adhesive strength of a thin film on an anisotropic substrate”. J. Mech. Phys. Solids, 57:1, 51-66.  DOI: 10.1016/j.jmps.2008.10.002.